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Photonics Packaging Engineer
Description:
LOOKING FOR A PACKAGING ENGINEER Are you a skilled packaging engineer prepared to dive into the dynamic atmosphere of Montreal, collaborating with an innovative and forward-looking company? Do you dream of making a significant mark on the world by influencing the evolution of autonomous vehicles? If your answer is yes, this is the opportunity for you! ABOUT THE OPPORTUNITY Workland presents an amazing career opportunity for its client, One Silicon Chip Photonics (OSCP), currently seeking a Packaging Engineer who is passionate about packaging design and development to contribute to the advancement of OSCP's optical gyro modules and Inertial Measurement Unit products. OSCP is a fast-growing Canadian company based in the beautiful city of Montreal, whose technology portfolio focuses on photonic integrated sensors. The technology involves developing simple, compact, low-cost, low-power consuming, and high-performance sensors for applications in navigation systems such as Inertial Measurement Units (gyroscopes and accelerometers). WHY SHOULD THIS OPPORTUNITY INTEREST YOU? Opportunity to change the world through high-impact, next-generation technology. Develop modern & innovative technologies in the exciting field of autonomous navigation. Grow your skills and knowledge in state-of-the-art technology, with unlimited potential. Ability to contribute and have a major impact on the company's future. Be a part of the founding team of a company that will experience exponential growth in the next years. Exciting and challenging opportunities for continuous professional growth. Competitive compensation and benefits program. Start-up, high-tech, and down-to-earth work environment. Offices located in beautiful old Montreal. POSITION SUMMARY Reporting to the director of engineering, you will be leading all activities related to developing OSCP’s optical gyro modules and Inertial Measurement Unit products and any other tasks required. YOUR TASKS AND RESPONSIBILITIES WILL BE: Assist in the development of a part number system while collaborating with and supporting various design groups; Perform Thermal, Mechanical, and Environmental stress analysis on various packages; Design, test, prototype and implement mechanical packages for optical gyro modules and Inertial Measurement Units; Work on the packaging of sub-components including Silicon photonic chips, electronic circuits, PCB’s, lasers, Phase Modulators; Producing 3D models, design annotations, 2D CAD drawings; Determine specifications of components for outsourcing; Streamlining and standardizing designs within the future Enterprise Resource Management Software (ERMS), including the preparation of Bill of Materials (BOM); Participate in other support activities that require Mechanical designs such for the creation of test fixtures and test assemblies for Photonics and Hardware Components; Perform quality control and statistical process control to facilitate product scale-up and commercialization. REQUIREMENTS FOR THIS POSITION ARE: Minimum B.Sc. in Mechanical Engineering or equivalent. At least 3 years of relevant industrial experience in Electronics and opto-electronics packaging. Comprehensive knowledge of packaging of electronics and optoelectronics components. Expert-level knowledge in CAD software tools preferably SolidWorks, CATIA, AutoCAD, or ANSYS. Knowledge of Thermal simulation analysis and tools Knowledge of hermetically sealed, waterproof, and splashproof design and MIL standards Hands-on experience with fabrication methods such as CoB, Chip on Carrier, and CSP. Familiarity with JEDEC standards including HAST, Electrostatic Discharge, Semiconductor Device Failure Mechanism, and Temperature Cycling Experience in automotive or aerospace certification will be an asset Bilingualism in French and English is an asset. IDEAL CANDIDATE CHARACTERISTICS: Being proactive and creative Self-motivated Strong problem-solving skills Team-oriented Excellent communication and interpersonal skills Effective time management skills *** ABOUT WORKLAND Workland is proud to have been mandated to assist this company in the recruitment process for this great job opportunity. Workland’s mission is to solve recruitment and job search problems by combining marketing, technology, and experienced professionals. The ultimate goal is to accelerate and facilitate the process of connecting talented professionals with the right organizations through an approach that promotes diversity, equity, and inclusion in the workplace.
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More About this Listing: Photonics Packaging Engineer
Photonics Packaging Engineer is a Engineering Engineer Job at The Agency by Workland located in Canada. Find other listings like Photonics Packaging Engineer by searching Oodle for Engineering Engineer Jobs.
Photonics Packaging Engineer is a Engineering Engineer Job at The Agency by Workland located in Canada. Find other listings like Photonics Packaging Engineer by searching Oodle for Engineering Engineer Jobs.